應用材料矽谷EPIC中心斥資50億美元打造 加速AI時代半導體創新 (2026.10.13)

應用材料公司正式揭幕其設備與製程創新暨商業化（Equipment and Process Innovation and Commercialization, EPIC）中心。這項耗資 50 億美元打造的設施，是全球規模最大的半導體製程技術與…

Samsung Starts Mass Production of Industry’s Smallest 0.64μm-pixel Mobile Image Sensor (2021.06.10)

Samsung Electronics today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp)…

COVID-19 Impact on Global Semiconductor Production to be Moderate but Severe on IDMs: MIC (2020.04.14)

MIC (Market Intelligence & Consulting Institute), a government think tank and IT research institute in Taiwan, has fores…

Samsung Electronics Unveils Its First Family of 'Human-centric' LED Components (2020.03.11)

Samsung Electronics today unveiled its first "human-centric" LED packages, collectively known as LM302N. Engineered with…

Baidu and Samsung Ready for Production of New Edge AI Chip for Early Next Year (2019.12.18)

Baidu and Samsung Electronics today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has complet…

Samsung Electronics Introduces New 3D Memory With Sixth-gen V-NAND SSDs for Client Computing (2019.08.06)

Samsung Electronics announced that it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integ…

Samsung Starts Producing First 512GB Universal Flash Storage (2017.12.05)

Samsung Electronics today announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded…

NAND Flash Prices to Keep Rising in 3Q17, TrendForce Says (2017.08.21)

DRAMeXchange, a division of TrendForce, reports that the NAND Flash market continued to experience tight supply in the s…

1Q17 Global DRAM Revenue Rose by 13.4% Due to a 30% Hike in PC DRAM (2017.05.18)

The global DRAM revenue reached a new record high in the first quarter of 2017, reports DRAMeXchange, a division of Tren…

New LED Components for Automotive Lighting, Featuring Chip-Scale Packaging (2016.06.21)

Samsung Electronics announced that it has introduced “Fx-CSP,” a line-up of LED packages which features chip-scale packa…

World’s Largest Capacity (15.36TB) SSD for Enterprise Storage Systems (2016.03.03)

Samsung Electronics announced today that it is now shipping the industry’s largest solid state drive (SSD) – the “PM1633…

Samsung and LG See Sharp Rise in Patent Applications for Flexible Displays (2016.02.01)

Both Samsung and LG have made some breakthroughs in flexible AMOLED technology and have largely increased their patent f…

Samsung Begins Mass Producing World’s Fastest DRAM (2016.01.19)

Samsung Electronics announced today that it has begun mass producing the industry’s first 4-gigabyte (GB) DRAM package b…

New 128GB Memory Card Solution Couples Maximum Speed (2015.12.23)

Samsung Electronics unveiled its newest memory card globally—the PRO Plus 128GB microSD card. Built with Samsung’s advan…

Samsung to Launch Mobile Payment Service: Samsung Pay (2015.08.14)

Samsung Electronics unveiled today that Samsung Pay, a secure and easy-to-use mobile payment service that can be used to…

Samsung Electronics Producing Industry’s First M.2 NVMe PCIe SSD for PC Market (2015.04.16)

Samsung Electronics announced today that it has started mass production of the industry’s first NVMe PCIe solid state dr…

Stronger Competition Forecast for Mobile Phone Display Manufacturers (2015.03.06)

Global mobile phone display module shipments in 2015 are expected to rise just 4% Y/Y to reach 2 billion units, leading …

New Image Sensor and NFC IC From Samsung For Advanced Mobile Devices (2015.03.04)

Samsung Electronics announced new cutting-edge mobile component solutions that advance users’ mobile experiences. These …

HTC (2014.07.24)

TAIPEI, Taiwan — More and more smartphone CFs debuted on the Internet, recently, HTC's smart watch was leaked in its Int…

Morris Chang Resigned, CO-CEO Era Begin in TSMC (2013.11.13)

Morris Chang, Chairman and CEO of TSMC, has resigned from CEO, which position will be took over together by Mark Liu and…