Anritsu 安立知將於 ECOC 2025 展示多芯光纖品質評估技術 (2025.09.25)
Anritsu 安立知將於 2025 年 9 月 29 日至 10 月 1 日參加在哥本哈根舉行的歐洲光通訊展 (ECOC 2025；攤位 C4335) ，現場展示針對多芯光纖 (multi-core optical fiber) 的品質評…
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Anritsu 安立知與 Fujikura 合作多方驗證次世代光通訊的 WC-MCF 核心串擾一致性 (2025.07.02)
Anritsu 安立知與藤倉株式會社 (Fujikura Ltd.) 合作，採用多種量測方法針對弱耦合型多芯光纖 (Weakly Coupled Multi-core Optical Fibers；WC-MCF) 之核心間串擾進行比較測試，…
TAIPEI, Taiwan - During the last 20 years, Airoha Technology, a Taiwanese fabless IC design house, MediaTek’s subsidiary…
Pulsonix PCB Design Adds 3D Collision Detection (2022.04.21)
Tewkesbury, UK– Pulsonix Announces the release of Pulsonix version 12.0, which adds new capabilities, speed improvements…
新一代異質運算帶動資料中心運算架構變革潮 (2022.01.25)
隨著人工智慧及大數據崛起，資料中心日益龐大，儲存容量也因疫後數位轉型加速而大幅成長。另一方面，智慧型網路卡與資料處理器所代表的新興加速運算裝置預料也將帶動伺服器硬體加速成長...…
恩智浦i.MX 93應用處理器系列提升安全邊緣智慧效能 (2021.11.15)
為了加速實現適用於各類物聯網、汽車和工業邊緣應用，恩智浦半導體（NXP Semiconductors N.V.; NXP）推出i.MX 93系列應用處理器，該系列處理器專為汽車、智慧家庭、智慧建築和智慧工廠應用而設計，運用邊緣機器學習，根據…
MediaTek Introduces Newest 5G SoC, Dimensity 800U for Ultra Connectivity and Advanced 5G Dual SIM (2020.08.18)
HSINCHU, Taiwan –MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Di…
videantis GmbH, a leading supplier of deep learning, computer vision and video coding solutions, today announced the ado…
The current COVID-19 pandemic situation has forced many companies to turn to conducting business remotely, with many emp…
BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applica (2020.03.24)
BrainChip Holdings today announced that Socionext Inc will offer customers an Artificial Intelligence Platform that incl…
Marvell today announced OCTEON TX2, the latest family of infrastructure processors targeting a wide variety of wired and…
HSINCHU, Taiwan - The Industrial Technology Research Institute (ITRI), Taiwan's largest and one of the world's leading h…
Andes Launches First DSP Instruction Set for RISC-V Multi-Core Processors to Challenge the HPC Marke (2019.04.22)
TAIPEI, Taiwan - Leading up to the RIC-V forum, RISC-V CON, which will be held in Hsinchu on May 9, Andes Technology Cor…
Samsung Electronics today announced its latest premium application processor (AP), the Exynos 9 Series 9820, equipped fo…
Broadcom Announces the World’s First xDSL CPE SoC with Integrated 802.11ax Wi-Fi 6 Technology (2018.10.24)
Broadcom today announced the availability of the industry’s first broadband SoC with integrated Wi-Fi 6 technology. The …
congatec announces the conga-SMX8, the company's first SMARC 2.0 Computer-on-Module based on the 64-bit NXP i.MX8 multi-…
MediaTek: We are in the Leading Position in 5G (2018.06.06)
TAIPEI, Taiwan - MediaTek, Inc. on June 5 announced that they would host their “Annual COMPUTEX Media Event,” with theme…
Sony Corporation announced that it has developed two new products, the SPRESENCE main and extension boards for IoT appli…
MediaTek Unveils Helio P60, the First SoC Platform Featuring a Multi-core AI Processing Unit (2018.02.26)
MediaTek unveiled the MediaTek Helio P60 system-on-chip (SoC), the first SoC platform featuring a multi-core AI processi…
Samsung Electronics announced the launch of its latest premium application processor (AP), the Exynos 9 Series 9810. The…