意法半導體：AI時代需從「系統端與全生命週期」重構能源效率 (2026.09.10)

資料中心在運算規模與功率密度上急速飆升，能源消耗與散熱瓶頸已成為不可忽視的工程挑戰。在 SEMICON Taiwan 2026 期間，意法半導體（STMicroelectronics）亞太區永續專案負責人 Edoardo Auteri 直言…

新一代Microchip MCU韌體開發套件 : MCC Melody簡介 (2024.10.30)

隨著積體電路製程不斷的演進，微控制器內建周邊與類比元件也日趨豐富與複雜，因此提供使用者快速且便捷的圖形化周邊配置與程式碼產生器也至關重要。除了縮短微控制器（MCU）韌體開發時程，也利於開發團隊進行專案的維護與更新。 有鑑於此，新一代MCC …

u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms (2024.09.02)

u-blox has strengthened its contribution to the NVIDIA Jetson and NVIDIA DRIVE Hyperion platforms as part of its strateg…

車用電子板階可靠度驗證AEC-Q007正式推出 車電安全大躍進 (2024.05.12)

宜特科技日前宣布，開始支援AEC-Q007聚焦的BLR板階可靠度測試，透過零件搭配PCB，將錫球與PCB端設計成導通模式，以便觀察焊點(Solder Joint)壽命。並於測試過程中搭配測量儀器，即時獲得資訊來判斷焊點良率，為車用電子的可靠…

French Start-Up Siquance Targets Commercial Quantum Computing Using Si Technology (2022.12.08)

Siquance, a CEA/CNRS-inspired startup, was launched in Grenoble on the 29th of November, 2022. Co-founded and directed b…

u-blox Announces Explorer Kits for Centimeter-Level Positioning Accuracy (2022.10.20)

u-blox has announced new explorer kits to make it quicker and easier for engineers to design and evaluate products requi…

Amphenol Launches the SnapEDA Viewer with Over 21,000 Free CAD Models (2022.09.28)

Amphenol Communication Solutions and SnapEDA are releasing over 21,000 new digital models to help designers bring their …

Avalue Is bringing the new embedded single board computers (2022.04.15)

TAIPEI, TAIWAN–Avalue Technology is bringing the new embedded single board computers, ECM-EHL, with IntelR PentiumR/Cele…

PICMG Releases new COM-HPC Carrier Board Design Guide (2022.02.09)

PICMG announces that the COM-HPC Carrier Board Design Guide is released and freely available on the PICMG website. The 1…

congatec, SYSGO Join Forces to Meet Functional Safety and Security of Computer-on-Modules (2021.11.17)

congatec announces its strategic partnership with SYSGO, Europe’s number one provider of real-time operating systems for…

Bird Debuts Smart Sidewalk Protection with u-blox (2021.11.02)

Bird, the leader in environmentally friendly electric transportation, today announced the first-of-its-kind smart sidewa…

TrendForce看2022年：6G與太空市場將漸抬頭 (2021.10.20)

市場研究機構TrendForce，今（20）日舉行「2022年集邦拓墣科技產業大預測」線上研討會。會中指出，2022年晶圓代工12吋產能將年增約14%；此外，電信商也將著眼6G技術；太空也將成為新戰場。 電信商著眼6G技術 強調多元化XR裝…

New framework of Platform Management Features for COM-HPC Based Edge Computing Designs (2021.08.15)

PICMG, a leading consortium for developing open embedded computing specifications, announces the release of the COM-HPC …

Nuvoton NuMicro M2354 Series Achieves World's First Mbed OS 6 Enabled IoT Security MCU (2021.08.05)

HSINCHU, Taiwan - Nuvoton Technology announces worldwide first Mbed OS 6 (the latest major version) supported developmen…

感測器融合技術臨門缺了哪一腳？ (2021.08.04)

AI智慧化發展加速前進，以汽車市場來說，不只動力來源從汽油轉向電動，連駕駛「人」的功能也逐漸被自動駕駛取代，想達到「真正的自動駕駛」境界，有賴先進感測器，以及比人腦更智慧的感測器融合技術助攻。…

u-blox Presents Bluetooth AoA Kits for High Precision Indoor Positioning (2021.07.01)

u-blox has announced the release of two “explorer kits” aimed at letting product developers evaluate the potential of Bl…

Pervasive Displays Adds Rugged EPDs to its Product Portfolio (2021.06.18)

TAINAN CITY, Taiwan – Pervasive Displays, recognized specialist in the development and supply of e-paper displays (EPDs)…

MicroSys Introduces World’s First System-on-Module with the NXP S32G274A Processor (2021.06.18)

MicroSys Electronics announces the world’s first System-on-Module (SoM) with NXP Semiconductors S32G274A processor. The …

Wiwynn Boosts Two-phase Immersion Cooling Development by Investing in LiquidStack (2021.03.28)

TAIPEI, Taiwan - Wiwynn announced an investment in LiquidStack, the world’s largest liquid cooling company, through Seri…

PICMG Announces Official Ratification of COM-HPC Specification (2021.02.25)

PICMG announces that COM-HPC has been approved and ratified, and is now available for public download and distribution. …