群聯推出客製化PCIe 5.0 SSD控制晶片方案 (2021.09.29)

群聯電子 (Phison)今日 (9/29) 推出次世代旗艦PCIe Gen5 SSD控制晶片客製化方案PS5026-E26，為全球的伺服器與高階Client SSD客戶提供最先進的儲存技術。 搭載最新12nm製程的PCIe Gen5 SS…

Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (2020.11.26)

HSINCHU, Taiwan - Faraday Technology today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV…

eMemory and UMC Qualify NeoFuse IP on the Foundry’s 28nm High Voltage Process (2020.01.20)

HSINCHU, Taiwan – eMemory and United Microelectronics Corporation today announced that eMemory’s NeoFuse IP has been qua…

COF and Polarizer Demands Tighten in 2019, Says TrendForce (2019.04.03)

Demand in end applications has weakened in 1Q19, causing COFs (Chip on film) to exhibit no signs of undersupply in the m…

TrendForce: LTPS Market to Reach a Healthy Equilibrium in 2019 (2019.02.18)

The latest analysis of the panel market by WitsView, a division of TrendForce, finds that low prices and technological m…

eMemory introduces more security features to its eNVM IP for TSMC 7nm Process (2018.04.27)

HSINCHU, Taiwan – eMemory today announced the successful verification of its secure eNVM IP for TSMC’s advanced processe…

eMemory, Europractice IC Service Form eNVM IP Partnership (2018.04.02)

HSINCHU, Taiwan – eMemory announces its collaboration with Europractice to offer eMemory’s eNVM (Embedded Non-volatile M…

Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking (2017.12.21)

Broadcom today announced the industry’s first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeti…

AVX Releases New Vertical, Poke-Home, Wire-to-Board Connectors for Discrete 18–22AWG Wire (2017.12.18)

AVX Corporation has extended its range of vertical wire-to-board (WTB) connector solutions with the release of the new 0…

eMemory’s NeoFuse Implemented in HV Process for OLED Application (2017.03.08)

HSINCHU, Taiwan – NVM IP provider eMemory announces today its NeoFuse IP has been extensively implemented in High Voltag…

GUC Unveils SSD ASIC Capabilities targeting TSMC 28nm Process Technologies (2017.02.02)

HSINCHU, Taiwan - Global Unichip Corp. (GUC) today rolled out its complete portfolio of solid state drive (SSD) ASIC cap…

AVX Releases New Vertical Poke-Home Connector Carefully Tooled for 18AWG Applications (2017.01.18)

AVX Corporation has released the first vertical connector capable of successfully bridging the gap between inexpensive, …

Reflective Optical Sensor Saves Space and Lowers Costs (2016.12.08)

The Optoelectronics group of Vishay Intertechnology introduced a new reflective optical sensor for smart home, industria…

Large-Size LCD Panel Shipments Fell 2.4% Monthly in October, Says TrendForce (2016.11.22)

Though panel shipments were strong in October, they represented a monthly drop from the much larger shipments in Septemb…

聚焦『封裝五大法寶』之二：晶圓級晶片尺寸封裝 (2016.08.15)

關鍵的封裝技術，目前已在不同階段的運用和生產，並將通過幾代的發展，繼續服務半導體行業的需求。…

ARM Announces POP IP for ARM Cortex-A73 on TSMC 16FFC Process (2016.06.14)

ARM announced the availability of ARM Artisan physical IP, including POP IP, for mainstream mobile SoCs based on the new…

eMemory NeoFuse IP Qualified in 40nm EHV Process (2016.05.23)

HSINCHU, Taiwan – eMemory today announces the immediate availability of its OTP technology NeoFuse qualified in the 40nm…

SMIC, Leadcore Jointly Announce 28nm HKMG Process Ready to Launch (2016.02.17)

Semiconductor Manufacturing International Corporation ("SMIC"), and Leadcore Technology Co. Ltd. ("Leadcore"), jointly a…

eMemory Announces Tape-out of NeoFuse Silicon IP for Automotive Panel Driver IC (2016.01.14)

Hsinchu, TAIWAN – eMemory has announced the tape-out of NeoFuse silicon IP for automotive panel driver IC with high reli…

Imec, Cadence Complete Tapeout of First 5nm Test Chip (2015.10.08)

Nano-electronics research center imec and Cadence Design Systems today announced that the companies completed the first …