Qnity啟諾迪拓展AI先進封裝能力 提供端對端製程解決方案 (2026.08.26)
啟諾迪電子公司（Qnity）推出一個可規模化的材料解決方案平台，該平台整合了金屬化（Metallization）、凸塊製程（Bumping）、介電材料（Dielectric）及精細線路圖案化（Fine-line patterning）等技術…
搜尋「Critical Dimension」，共 66 筆
半導體虛擬量測 邁向零缺陷製造 (2026.03.23)
虛擬量測技術是半導體產業從經驗驅動轉向數據驅動的里程碑。它不僅解決了實體量測的瓶頸，更為晶圓廠提供了製程透明度。…
ASML助晶圓代工簡化工序 2025年每晶圓用電降30~35% (2024.09.06)
因AI人工智慧驅動半導體需求，全球晶片微影技術領導廠商艾司摩爾（ASML）今（6）日於SEMICON Taiwan 分享新一代高數值孔徑極紫外光（High NA EUV）微影技術，並表示將協助晶片製造商簡化製造工序、提高產能，並降低每片晶圓…
應材推出電子束量測系統 提升High-NA EUV製程的控制與良率 (2023.03.08)
由於包含極紫外光（EUV）和新興高數值孔徑（High-NA）的光阻越來越薄，量測半導體元件特徵的關鍵尺寸變得愈來愈具挑戰性。應用材料公司最新推出新的電子束（eBeam）量測系統，則強調專門用來精確量測由EUV和High-NA EUV微影技術…
Intel 4製程技術細節曝光 具備高效能運算先進FinFET (2022.07.04)
英特爾近期於美國檀香山舉行的年度VLSI國際研討會，公布Intel 4製程的技術細節。相較於Intel 7，Intel 4於相同功耗提升20％以上的效能，高效能元件庫（library cell）的密度則是2倍，同時達成兩項關鍵目標：它滿足開…
Imec demonstrates 24nm pitch lines with single exposure EUV lithography on ASML’s NXE:3400B scanner (2020.02.27)
This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nano…
Samsung Electronics today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) tec…
文New Numerical Investigation of the Reinforcement Efficiency of Long Carbon Fiber Composites (2018.03.15)
Long carbon fiber reinforced thermoplastics (LCFRT) have become familiar lightweight automotive materials since they sat…
STMicroelectronics has introduced a matched balun for its S2-LP 868-927MHz low-power radio transceiver to help engineers…
HSINCHU, Taiwan - Macronix International today announces that it has four technical papers selected for presentation at …
New Material Approach for MEMS and 3D IC (2016.10.20)
PiBond today announced that its SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever …
Keysight Technologies announced that it has extended One-Stop Calibration Services, to include non-Keysight equipment, r…
[專欄]5G正式到來前的LTE Advanced Pro賣些什麼？ (2016.07.13)
近期，3GPP組織對LTE技術標準的進程與方向有更明確的規劃。在說明規劃前筆者先簡單說明過往發展：2008年的R8標準正式進入LTE，之後R9進行LTE改進；2011年的R10標準正式進入LTE Advanced（簡稱LTE-A），R11則…
At IEEE IEDM conference, imec showed for the first time the integration of high mobility InGaAs as a channel material fo…
Touch technology drives the success of smart phones and tablet PCs in commercial market, and is a very important man-mac…
IBM Takes One More Step Toward Quantum Computer (2015.04.30)
IBM scientists today unveiled two critical advances towards the realization of a practical quantum computer. For the fir…
KLA-Tencor以全新量測系統擴充5D圖案控制解決方案 (2015.03.05)
為了因應先進積體電路製程挑戰，KLA-Tencor近期推出兩款量測設備，可支援16奈米(含)以下尺寸積體電路元件的研發和生產：Archer 500LCM和SpectraFilm LD10。Archer 500LCM overlay量測設備在…
Molex introduced its Rigid Flex Circuits and Assemblies. Ultra-reliable Molex rigid flex circuits and assemblies minimiz…
Broadcom Corporation announced the industry's highest performance, lowest power multi-rate 100 Gigabit Ethernet (GbE) ge…
Infineon Technologies AG introduced a series of antenna tuning ICs. The new family of antenna aperture tuning switches a…