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DELO Introduces Compact LED Curing Lamp DELOLUX 503

瀏覽次數:3552

DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.

Increasing miniaturization calls for more compact production systems. When developing the new lamp, special attention was also paid to minimum installation dimensions. The lamp comes with another feature: its light is directed diagonally downwards, so it does not need to be installed at level with the components to be bonded. This gives more moving space to axes or grippers and facilitates integration into complex systems.

At a typical working distance of 15 mm, the DELOLUX 503 curing lamp irradiates an area of 18 mm x 6 mm. This high-performance spot light source is available in two versions. One model, featuring a wavelength of 365 nm and a nominal intensity of more than 1000 mW/cm2, has been optimized for fast fixation in less than a second. The second version with a wavelength of 400 nm and an intensity of more than 1600 mW/cm2 has been developed with a focus on optimized deep curing of the adhesive and better penetration of hardly translucent plastics.

Thanks to continuous intensity control as well as internal control and monitoring of important parameters such as the LED temperature, the UV lamp ensures high process reliability. Up to four LED heads can be controlled by the DELO-UNIPRO and DELO-UNIPRO Light controllers or by an external PLC, allowing the adhesive to be evenly exposed from several sides.

LED lamps are the leading technology in the field of curing lamps. Their emission spectrum can be adjusted to the specific adhesive, enabling optimized curing of the adhesive and preventing unnecessary heat input into the component from unused wavelengths. The LEDs great longevity and low energy consumption help make production processes highly cost-efficient.

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

關鍵字:semiconductor