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Intel Xeon/Gen7 Core CPU COM Express Basic Module From congatec

瀏覽次數:502

congatec extends its COM Express Basic portfolio with the new high-performance conga-TS175 Computer-on-Module. Equipped with the high-end dual chip versions of the brand new Intel Xeon and Gen 7 Intel Core processors (codename Kaby Lake), it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.

Application areas for these high-end COM Express Type 6 Server-on-Modules can be found everywhere where data intensive streams need to be processed and displayed in real time. Target markets include big data processing embedded clouds, edge and fog servers, medical imaging systems, video surveillance and vision-based quality control, simulation equipment, host systems for virtualized control technology, vision systems in industrial control rooms and other plant-wide supervision systems or high-end professional gaming and digital signage.

Compared to their predecessors (codename Skylake), the new modules host increased CPU frequencies and performance, more dynamic HDR graphics thanks to 10-bit video codecs, and support super-fast 3D XPoint-based Intel Optane memory. In comparison to the single chip variants of the new Gen 7 Intel Core processors, the dual chip versions set the latest state-of-the-art benchmark for high-end Server-on-Module applications and high-end embedded use cases with hyper threading within the embedded power envelope of up to 45 Watts.

The new conga-TS175 COM Express Basic module is available with two quadcore Intel Xeon processors with hyper threading as well as 5 different Intel Core i7, i5 and i3 processors within a 45 to 25 W TDP envelope. Bandwidth intensive applications will benefit from up to 32 gigabytes of fast dual channel 2400 DDR4 memory - including ECC support option.

In regards to visual experience, they feature the new Intel HD630 graphics supporting up to three independent displays with up to 4k @ 60 Hz via DisplayPort 1.4 and HDMI 2.0 - both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules also offer dual channel LVDS and VGA for legacy displays. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions.

The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel Optane memory can be connected via PCI Express Gen 3.0 Lanes. 4x SATA 6G ports with RAID0/1 support are available for conventional storage media. Further I/O interfaces include 1x Gigabit Ethernet with Intel AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIOs, LPC, SPI, I2C Bus, and 2x UART.

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

關鍵字:industrial pc