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ADLINK’s MVP-5000 Fanless Embedded Computers with 6th Gen Intel Core CPU

瀏覽次數:1599

ADLINK Technology has announced the release of the MVP-5000 series, the newest member of ADLINK’s value family of fanless embedded computing platforms.

The MVP-5000 series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation Intel Core processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK’s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.

Practically any industrial automation application in need of a rugged and compact platform will benefit from the MVP-5000’s comprehensive front-mounted I/O coverage, and pre-validated rich LGA 1151 socket-type 6th Generation Intel Core i7/i5/i3/Pentium/Celeron processors offer a host of CPU choices, guaranteeing maximum compatibility and flexibility for the most price sensitive industrial applications.

The MVP-5000 series provides dual-channel DDR4 SO-DIMM sockets for up to 32 GB of memory, and the Intel HD Graphics 530 supercharges graphics performance. Dual independent displays are fully supported, with 1 VGA, 1 DVI and 2 DisplayPorts, 2 software-programmable RS-232/422/485 and 2 RS-232 ports, 3 Intel GbE ports with teaming function, 6 external USB ports (4 USB 3.0 and 2 USB 2.0), and 8CH DI/O.

Rigorous testing for operational verification assures reliability and ruggedness, both critical for complete functionality when facing the rigors of demanding industrial application environments. Along with a versatile I/O array and flexible expansion capacity, the MVP-5000 series fully satisfies all the needs of machine, factory, logistic automation, and general embedded applications.

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超大規模資料中心重塑AI基礎設施

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

關鍵字:industrial pc