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UMC and Avalanche Technology Partner for MRAM Development and 28nm Production

瀏覽次數:1152

HSINCHU, Taiwan - United Microelectronics Corporation and Avalanche Technology, Inc., the next generation STT-MRAM (Spin Transfer Torque Magnetic RAM) leader, today announced that they have entered a partnership for joint development and production of MRAM to replace embedded flash. UMC will also make this technology available to other companies through licensing with Avalanche Technology Inc.

Under the terms of the agreement, UMC will provide embedded non-volatile MRAM blocks based on UMC's 28nm CMOS manufacturing process. This will enable customers to integrate low latency, very high performance and low power embedded MRAM memory blocks into MCUs and SoCs, targeting the Internet of Things, wearable, consumer, industrial and automotive electronics markets.

The two companies are also considering to expand the cooperation beyond 28nm, as Avalanche Technology’s CMOS compatibility and scalability to advanced process nodes enables integration of unified memory (non-volatile as well as SRAM) blocks into next generation highly integrated MCUs and SoCs. This allows system designers to maintain the same architecture and software ecosystem without a redesign.

"We're excited to team with a world leader in semiconductor manufacturing such as UMC to bring this outstanding technology to market," said Petro Estakhri, CEO and co-founder of Avalanche Technology.

"UMC is continuously introducing enhanced process offerings to bring added competitive benefits to our customers," said G C Hung, vice president of Advanced Technology Development at UMC. "With embedded NVM becoming more prevalent in today’s IC designs, we have developed a strong portfolio of robust eNVM process solutions for high growth sectors such as emerging consumer and automotive applications. We are happy to cooperate with Avalanche Technology for 28nm MRAM, and we look forward to ramping this process to production for UMC customers."

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

超大規模資料中心重塑AI基礎設施

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為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。