Supporting next-generation 400 Gbps Ethernet applications, Molex’s zCD Interconnect System will transmit 400 Gbps data rates (25 Gbps per-serial-lane) with excellent signal integrity (SI), electromagnetic interference (EMI) protection and thermal cooling.
The zCD connector will offer the densest, fastest interconnect in the market and is currently being defined by the new CDFP multi source agreement (MSA).
The connector will be offered in two styles: style 1 (short body) for passive or active copper cables; style two (long body) for optics such as active optical cables (AOCs) or pluggable transceivers.
The zCD passive copper cable assemblies will offer the densest 25 Gbps copper solution in the market when used with the zCD style 1 connector. The small and highly flexible assembly will use proven individual twinax and braid construction for short-reach 400 Gbps Ethernet (GbE) or legacy and proprietary applications.
The zCD AOCs will deliver 16-by-28 Gbps, or 400 Gbps of bandwidth, in a compact CDFP MSA standard interface. The zCD AOC design is based on singlemode silicon-photonics technology and will transmit up to 4km for a fraction of the cost and power of long-reach optical modules. Primarily designed for 400 Gbps Ethernet applications, zCD AOCs will function with InfiniBand and proprietary protocol applications.
