搜尋

會員登入

搜尋

導覽

會員
廣告
廣告

u-blox Launches New GNSS Chip for Wearable Featuring Ultra-low Power and High Accuracy

瀏覽次數:3822

u-blox has introduced a new, ultra-low power GNSS chip that represents a major breakthrough in compact and efficient positioning technology. The UBX-M10150-CC GNSS is poised to revolutionize the design of compact wearable devices like sports and smart watches by offering an unprecedented combination of size, efficiency, and performance.

The UBX-M10150-CC meets the needs of wearables manufacturers looking for a highly accurate positioning solution that will minimize power consumption and prolong the battery life of their device. It features pioneering LEAP (Low Energy Accurate Positioning) technology that achieves a mere 10mW power consumption. In combination with its smart adaptation to signal conditions, LEAP allows a 50% reduction in power consumption compared to previous M10 chips, which means that users can enjoy their wearable devices for longer without frequent recharging.

This ultra-lower power, high accuracy chip comes in the smallest form factor. With dimensions of only 2.39 x 2.39 x 0.55 mm, the UBX-M10150-CC facilitates the creation of sleek and slender product designs, enabling manufacturers to produce more attractive and comfortable wearable devices.

The UBX-M10150-CC may be compact, but it is packed with features to enhance the user experience. Multipath mitigation increases position accuracy, particularly in challenging urban environments where signal reflections are common. The chip even has a mode for open water swimming, a boon for aquatic sports enthusiasts wanting to track their activities.

Further benefits accrue from the chip’s upgradeable firmware, which allows for the introduction of new features and capabilities over time, enhancing the value proposition of the end product. Additionally, the product comes with Android and SUPL support for easy integration.

First samples of this innovative GNSS chip are available now, allowing for immediate integration and testing by manufacturers.

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

超大規模資料中心重塑AI基礎設施

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

關鍵字:GPSGNSS