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AAEON Adds UP Squared 6000, An Industrial Maker Board to Its Expanding UP Family

瀏覽次數:2117

AAEON announced its introduction of UP Squared 6000, an industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by IntelR AtomR x6000E/RE, PentiumR or CeleronR N/J series SoC (formerly Elkhart Lake) to its expanding UP Family. With the next-generation IoT-enhanced processors, UP Squared 6000 delivers upgraded single-thread, multi-thread and graphical performances, and features IntelR Programmable Service Engine (PSE) and onboard TPM to accelerate and optimize AIoT vertical applications.

To drive optimal performances required for today’s vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications, UP Squared 6000 delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by IntelR UHD Graphics (11th Generation GPU). By adopting the next-generation IoT-enhanced processors, UP Squared 6000 brings improved performance and efficiency in artificial intelligence deployments.

Expansion and scalability are critical in edge AIoT deployments. To meet the design requirements, UP Squared 6000 comes with multiple M.2 sockets for IntelR Myriad X module, NVMe storage, 5G connectivity and Wi-Fi5/6 modules. In addition, UP Squared 6000 features 40-pin GPIO (HAT-compatible) and 100-pin board-to-board connector (available in IntelR AtomR x6000E/RE SKUs only) for I/O expansions through a carrier board. With the carrier board, UP Squared 6000 will drive full potential of IntelR Programmable Service Engine by offering CAN Bus, QEP, additional dual GbE Ethernet ports, and RS-232 for industrial applications.

By integrating the carrier board, UP Squared 6000 can drive the potential of IntelR Programmable Service Engine (PSE) offering Out-of-Band (OOB) Management, allowing IT personnel to remotely manage manufacturing assets even when the operating system is unresponsive or the device is powered off.

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

超大規模資料中心重塑AI基礎設施

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

關鍵字:AIoT