搜尋

會員登入

搜尋

導覽

會員
廣告
廣告

Innovative Logic, M31 Introduce a SuperSpeed USB 3.0/2.0 Dual Role IP Solution

瀏覽次數:2637

Innovative Logic together with M31 Technology jointly announce certification completion of its USB 3.0 dual role device and host controller IP.

Inno-Logic’s USB3.0 host controller along with PHY from M31 Technology again successfully passed all compliance tests and received certification from USB-IF in December 2015. Besides of USB 3.0 host controller, the USB 2.0 host controller also passed the certification test in November, 2015.

Inno-Logic’s USB 3.0 dual role device and host controller IP supports SuperSpeed mode which is 10 times faster than traditional USB high speed mode. In addition, Inno-Logic’s USB3.0 IP is fully backward compatible with USB2.0.

M31 Technology USB 3.0/2.0 PHY IP is extremely popular and well received by their existing customers for maturity, quality, compact size and support ranging from most popular to most advanced nodes.

“By again receiving certification for our USB3.0/2.0 IP, we have demonstrated strong commitment to providing quality IP. It also demonstrates our ability to provide complete USB3.0/2.0 solution to our customer” said Dinesh Tyagi, President & CEO at Innovative Logic.

“M31 is delighted again to get our USB3.0/2.0 PHY IP with Inno-Logic’s USB3.0/2.0 host controller IP certified which was targeted for 40nm technology process. We always want to make sure that our customer receives complete solution instead of getting in bits and pieces. We are extremely proud to have one more milestone in that direction along with Innovative Logic” said Hsiao-Ping Lin, the Chairman of M31 Technology Corporation.

Innovative Logic’s USB 3.0/2.0 IP is available for licensing worldwide. It is available in RTL source code version along with complete verification suite with all the test vectors, scripts, manuals, etc. Innovative Logic also has fully working FPGA demo along with M31 PHY IP for demonstration, evaluation, prototyping and emulation purposes.

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

超大規模資料中心重塑AI基礎設施

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

關鍵字:USB 3.1USB type-C