FTDI Chip announced the full production release and availability of its FT60x series, a sophisticated USB3.0 to FIFO bridge in a choice of low pin count packages. In addition, 4 corresponding evaluation/development modules are also now available.
The FT600 and FT601 are FTDI Chip's first generation USB3.0 products that function as SuperSpeed USB3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. Designed with simplicity in mind, the chips are simple to connect and control, with no firmware development required - just "fit and forget".
The UMFT60xx range of evaluation/development modules with either FMC(LPC)/HSMC connectors have been designed to facilitate rapid integration of a SuperSpeed USB3.0 port into a design with the FT60x and we are accepting orders now. The series allows for bridging a FIFO bus to a USB3.0 host and evaluating the functionality of the FT60x.
As a daughter card, the UMFT60xx must work with a FIFO master board which has either a FMC or HSMC connector. There are 4 modules which provide different FIFO bus interfaces and data bit widths, and they are designed to plug in to most FPGA development platforms supplied by vendors such as Xilinx or Altera.
Features:
－ Support for USB3.0 SuperSpeed (5Gbps), USB High Speed (480Mbps) and USB 2.0 Full Speed (12Mbps) transfer
－ Available with either 16bit/32bit wide parallel FIFO interface
－ Supports 2 parallel slave FIFO bus protocols, with data bursting rate up to 400Mbps
－ Supports multi channel FIFO interface
－ Up to 8 configurable endpoints (pipes)
－ Built-in 16kB FIFO data buffer RAM
－ Supports multi voltage I/O: 1.8V, 2.5V and 3.3V
－ Configurable GPIO support
－ Supports Remote Wakeup capability
－ Provides USB Battery Charger Detection
－ Integrated power-on-reset circuit
－ Extended operating temperature range: -40°C to 85°C
－ Available in compact Pb-free QFN-56, 16-bit (FT600) and QFN-76, 32-bit (FT601) packages
