At the Intel Developer Forum(IDF), Shenzhen, China, Rockchip CEO Min Li joined Intel CEO Brian Krzanich on stage, said that multiple original design manufacturers (ODMs) are designing products based on the Intel Atom x3-C3230RK quad-core processor reference design from Rockchip, with devices expected to be in market later this quarter.
Last year, Rockchip formed a strategic collaboration with Intel to expand the offerings of the Intel Atom x3 processor family (SoFIA) for entry and value tablets, phablets and smartphones.
Currently, there were 20 companies, with more than 45 tablet, phablet and smartphone designs currently in development based on the Intel Atom x3 processor reference designs.
Intel also showcased the first live demonstration of the Intel Atom x3 processor in a smartphone, supporting LTE-TDD connectivity over China Mobile's network. The part is expected to ship in the second half of this year.
In addition, Intel announced the expansion of the Intel Atom x3 processor roadmap with the addition of 3G and LTE processors for the Internet of Things. The new purpose-built processors will be offered with an extended temperature range for extreme weather conditions, support for Linux and Android, and seven years of extended product lifecycle support. Developer kits will be available in the second half of this year.
