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Samtec Announces Over 200,000 Symbols & Footprints for Its interconnect Products

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Samtec, a global manufacturer of interconnect solutions, announced that it now has over 200,000 symbols & footprints for its products to accelerate the design process for engineers.

Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints. Samtec and SnapEDA have teamed up to make these models readily available to engineers, because they both believe that engineers deserve the best in terms of ease-of-use, quality, and convenience.

In the second quarter of 2020, SnapEDA created over 120,000 new Samtec connector models, including high-speed and micro-pitch board-to-board, edge card, and rugged connectors. With these new connector models, engineers can now easily discover, and design-in Samtec products.

“Samtec is an inspiration when it comes to their dedication to the customer experience. Whether it’s their 24-hour free sample program, or their endless pursuit to expand the availability of design resources for their products, Samtec is truly world-class. These new models are yet another example of that dedication to their customers,” said Natasha Baker, CEO and Founder of SnapEDA, based in San Francisco, CA.

Connector models are highly sought-after by engineers, because they are incredibly time-consuming for which to create models. This is due to their non-standard bodies, custom solder stencils, fine pitches, irregular pad shapes, and cutouts. Accordingly, connectors are the third most popular category of components on SnapEDA.

“SnapEDA’s commitment to quality, innovation, and ease of doing business has made them a great partner for Samtec as well as our partners in the digital channel. They’ve enabled us to better serve our customers by offering quick and immediate access to hundreds of thousands of our most popular parts,” said Ashley Quinlan, Strategic Marketing Director at Samtec.

All models can be downloaded from Samtec’s website. They are also available on SnapEDA, as well as through over a dozen of its collaborators including Digi-Key and Mouser Electronics.

Formats supported include Cadence OrCad, Allegro, Altium, Autodesk Eagle, Mentor PADS, KiCad, PCB123, and Proteus.

These new, high-quality models were created by SnapEDA’s Component Engineering team using proprietary, patented technology. They include accurate assembly, silkscreen, and contoured courtyards, and follow Samtec’s recommended PCB layouts and stencil patterns. Through-hole pads follow IPC-2221 standards using nominal drill hole sizes.

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

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